Method of making halogen-free circuitized substrate with reduced thermal expansion
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United States of America Patent
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Aug 6, 2013
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Mar 2, 2009
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Oct 3, 2006
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Abstract
A method of making a circuitized substrate including a composite layer having a first dielectric sub-layer including a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein.
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