Thermal interface material for reducing thermal resistance and method of making the same
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United States of America Patent
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Jul 30, 2013
Grant Date -
Mar 15, 2012
app pub date -
Sep 10, 2010
filing date -
Sep 10, 2010
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Abstract
The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.
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