Terminal face contact structure and method of making same
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United States of America Patent
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Jul 30, 2013
Grant Date -
Mar 10, 2011
app pub date -
Mar 10, 2009
filing date -
May 14, 2008
priority date (Note) -
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Abstract
The invention relates to a contact structure (24) and to a method for producing a contact structure for semiconductor substrates (21) or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part (22) arranged on a terminal face (20) of the semiconductor substrate and at least one connecting contact part (23) arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material (34) which has a lower melting point than a base contact material of the base contact part.
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