Repairing defects in a nonvolatile semiconductor memory module utilizing a heating element
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United States of America Patent
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Jul 30, 2013
Grant Date -
Sep 20, 2012
app pub date -
Jun 1, 2012
filing date -
Sep 5, 2007
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Abstract
A memory module includes multiple memory devices mounted to a substrate and one or more discrete heating elements disposed in thermal contact with the memory devices. Each of the memory devices includes charge-storing memory cells subject to operation-induced defects that degrade ability of the memory cells to store data. The discrete heating elements, or single discrete heating element, heats the memory devices to a temperature that anneals the defects.
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