Three-dimensional network in CMP pad
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United States of America Patent
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Jul 23, 2013
Grant Date -
May 28, 2009
app pub date -
Oct 23, 2008
filing date -
Oct 26, 2007
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Abstract
The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
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