Polishing pad, use thereof and method for making the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8491359
APP PUB NO 20110045744A1
SERIAL NO

12862098

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
BESTAC ADVANCED MATERIAL CO LTD5F-2 NO 185 KEWANG RD LONGTAN TOWNSHIP TAOYUAN COUNTY 325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Chung-Chih Kaohsiung, TW 112 308
Hung, Yung-Chang Kaohsiung, TW 45 119
Wang, Lyang-Gung Kaohsiung, TW 21 42
Wu, Wen-Chieh Kaohsiung, TW 53 137
Yao, I-Peng Kaohsiung, TW 79 189

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 23, 2025
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00