Method and apparatus for providing acknowledgment bundling
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United States of America Patent
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Jul 16, 2013
Grant Date -
Dec 31, 2009
app pub date -
Jun 23, 2009
filing date -
Jun 23, 2008
priority date (Note) -
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Abstract
An approach is provided for acknowledgement bundling. Dynamically scheduling of one or more of subframes per bundling window is performed by reusing an assignment index field (e.g., downlink assignment index (DAI) field). The assignment index field has a value greater than or equal to number of previously assigned subframes within the bundling window. The bundling window defines a group of subframes for common acknowledgement.
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