Method for thermally contacting opposing electrical connections of a semiconductor component arrangement
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United States of America Patent
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Jul 16, 2013
Grant Date -
Oct 4, 2012
app pub date -
Sep 8, 2010
filing date -
Sep 9, 2009
priority date (Note) -
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Abstract
The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.
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