Structure and process for electrical interconnect and thermal management
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United States of America Patent
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Jul 16, 2013
Grant Date -
Mar 1, 2012
app pub date -
Sep 21, 2011
filing date -
Aug 28, 2007
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Abstract
A method for making a structure for thermal management of circuit devices. The method provides a first substrate and a second substrate where at least one of the first and second substrates includes a circuit element. The method forms in at least one of the first substrate and the second substrate an entrance through-hole extending through a thickness of the first substrate or the second substrate, forms in at least one of the first substrate and the second substrate an exit through-hole extending through a thickness of the first substrate or the second substrate, forms respective bonding elements on at least one of the first and second substrates, and bonds the first and second substrates at the respective bonding elements to form a seal between the first and second substrates and to form a first coolant channel in between the first and second substrates.
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