Ramped, variable power UV adhesive cure process for improved alignment
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United States of America Patent
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Jul 16, 2013
Grant Date -
Mar 28, 2013
app pub date -
Sep 27, 2011
filing date -
Sep 27, 2011
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Abstract
Methods and apparatuses for adhering optoelectronic components in optical, electronic or optoelectronic devices are disclosed. A UV-active adhesive is applied to an alignment sensitive component of the device. A first, relatively low dose of UV radiation sufficient to solidify an outer layer of the adhesive is applied to the adhesive. A second, relatively high dose of UV radiation sufficient to solidify the remaining thickness of the adhesive is then applied. The methods and apparatuses of the present invention advantageously reduce or eliminate changes in the position of a component during the adhesive curing process. The present method and apparatus allow for shorter total time for solidifying the adhesive, provide stable positioning during the adhesive solidification process, and enable increased manufacturing output and decreased waste.
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