Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
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United States of America Patent
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Jul 16, 2013
Issued Date -
N/A
app pub date -
Nov 9, 2010
filing date -
May 26, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing.
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