Systems for circuit board heat transfer and method of assembling same
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United States of America Patent
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Jul 9, 2013
Grant Date -
Nov 22, 2012
app pub date -
May 17, 2011
filing date -
May 17, 2011
priority date (Note) -
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Abstract
A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.
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