Thermosetting solvent-free single-component compositions and their use
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United States of America Patent
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Jul 9, 2013
Grant Date -
Aug 26, 2010
app pub date -
Jul 3, 2006
filing date -
Jul 5, 2005
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Abstract
We propose a thermosetting solvent-free single-component composition having a storage stability at room temperature of at least 2 weeks, consisting of
- (A) 5-90 parts by weight of one at least difunctional (iso)cyanate component,(B) 5-50 parts by weight of a latent curing agent solid up to a temperature of at least 40° C. based on nitrogen compounds suitable for addition crosslinking,(C) 0-50 parts by weight of an epoxy-containing compound and(D) 0-50 parts by weight of modifiers,with the sum of all parts by weight being 100, and its use for bonding, casting, sealing and coating of substrates, in particular electronic parts. The composition is cured at 120° C. to 150° C. within seconds.
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