Semiconductor component and method of making the same
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United States of America Patent
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Jul 2, 2013
Grant Date -
Jul 12, 2012
app pub date -
Mar 19, 2012
filing date -
Jul 7, 2008
priority date (Note) -
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Abstract
One embodiment provides a semiconductor chip including a semiconductor body and a power semiconductor component integrated therein. The power semiconductor component includes a load electrode zone arranged on a first surface of the semiconductor body, a control electrode zone arranged on the first surface, the control electrode zone being electrically insulated from the load electrode zone, and a resistance track arranged on the load electrode zone and the control electrode zone. The resistance track ensures an electrical connection between the load electrode zone and the control electrode zone.
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