Package structure and electronic apparatus of the same
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United States of America Patent
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Jul 2, 2013
Grant Date -
Sep 8, 2011
app pub date -
Sep 2, 2010
filing date -
Mar 8, 2010
priority date (Note) -
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Abstract
A package structure and an electronic apparatus of the package structure are disclosed. The package structure includes a substrate and a plurality of pins. The plurality of pins is disposed on the substrate. The plurality of pins is interlaced to each other, so that a line along a specific direction will only pass one of the plurality of pins at most.
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