Resin layer formation method, resin layer formation device, disk and disk manufacturing method
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United States of America Patent
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Jul 2, 2013
Grant Date -
Mar 29, 2012
app pub date -
Dec 2, 2011
filing date -
Jun 3, 2004
priority date (Note) -
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Abstract
A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.
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