Wafer structure and epitaxial growth method for growing the same

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United States of America Patent

PATENT NO 8475588
APP PUB NO 20090181525A1
SERIAL NO

12382329

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Abstract

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A wafer structure and epitaxial growth method for growing the same. The method may include forming a mask layer having nano-sized areas on a wafer, forming a porous layer having nano-sized pores on a surface of the wafer by etching the mask layer and a surface of the wafer, and forming an epitaxial material layer on the porous layer using an epitaxial growth process.

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Patent Owner(s)

  • SAMSUNG CORNING PRECISION MATERIALS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Sung-Soo Seongnam-si, KR 117 1030

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