Solder apparatus

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United States of America Patent

PATENT NO 8474681
SERIAL NO

13409347

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Abstract

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An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.

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Patent Owner(s)

Patent OwnerAddress
ANTAYA TECHNOLOGIES CORP72 FENNER STREET CRANSTON RI 02910

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cole, Lawrence Richard Marysville, US 1 0
Hendrick, John P West Kingston, US 3 5
Pereira, John Rehoboth, US 32 251

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