Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material

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United States of America Patent

PATENT NO 8470155
APP PUB NO 20100066273A1
SERIAL NO

11921154

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Abstract

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In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant.

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Patent Owner(s)

Patent OwnerAddress
NOMURA PLATING CO LTDOSAKA-SHI OSAKA 555-0033
HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION305-0801 TSUKUBA-SHI IBARAKI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higuchi, Tamao Aichi, JP 2 13
Ikeda, Tokumi Osaka, JP 7 30
Saito, Kenji Ibaraki, JP 306 2143

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