Workpiece processing system
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United States of America Patent
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Jun 18, 2013
Grant Date -
Oct 7, 2010
app pub date -
Apr 6, 2010
filing date -
Apr 7, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A workpiece processing machine, such as a laser cutting machine, includes a motion unit having an associated drive, a cutting head mounted on the motion unit and configured to deliver a cutting beam, and a suction duct or other form of beam interceptor coupled to the motion unit so that it moves therewith and an opening of the suction duct is positioned below the cutting head during a workpiece processing operation. The machine also includes a frame configured to support the motion unit and defining a movement area of the motion unit, the frame having a beam located generally centrally in the movement area.
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