Base for circuit board, circuit board, and method of fabricating thereof
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United States of America Patent
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Jun 18, 2013
Grant Date -
Jul 1, 2010
app pub date -
Jun 3, 2009
filing date -
Dec 31, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A base of circuit board, a circuit board, and a method of fabricating thereof are provided. The circuit board includes a substrate, a plurality of elastic bumps and a patterned circuit layer. The elastic bumps arranged in at least an array are located on the substrate. The patterned circuit layer is located on a portion of the elastic bumps and a portion of the substrate. The base of the circuit board and the method of fabricating thereof are also included in the present invention.
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