Method for producing a thin chip comprising an integrated circuit
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United States of America Patent
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Jun 18, 2013
Grant Date -
Apr 16, 2009
app pub date -
Sep 11, 2008
filing date -
Mar 14, 2006
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Abstract
In a method for producing a very thin chip including an integrated circuit, a circuit structure is produced in a defined section of a semiconductor wafer. The defined wafer section is subsequently released from the semiconductor wafer. For this purpose, the wafer section is firstly freed such that it is held only via local web-like connections on the remaining semiconductor wafer, which web-like connections are arranged at a lateral periphery of the wafer section. The web-like connections are subsequently severed.
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