Methods of processing and inspecting semiconductor substrates
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United States of America Patent
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Jun 11, 2013
Grant Date -
Apr 19, 2012
app pub date -
Apr 18, 2011
filing date -
Apr 19, 2010
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Abstract
A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.
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