Injection molding method and apparatus for controlling a mold temperature and displacement of an injection screw

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United States of America Patent

PATENT NO 8460586
APP PUB NO 20110210461A1
SERIAL NO

13122505

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Abstract

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An injection molding device is provided with a mold, an injection unit equipped with an injection screw that is displaceably configured such that a molten resin is filled into a cavity by forward movement to perform plural injection operations including at least a filling operation and a pressure keeping operation by displacing the injection screw, a position sensor for detecting the position of the injection screw, a temperature sensor capable of measuring the temperature of the vicinity of the cavity of the mold, a temperature adjustment unit capable of adjusting the temperature of the mold by heating or cooling the mold, a control unit for controlling the displacement of the injection screw and the temperature of the mold and determining plural switching timings of the injection operations on the basis of the position of the screw, and a display unit for displaying an image. The control unit creates a temperature waveform of the vicinity of the cavity based on an input from the temperature sensor and displays a first correlation diagram showing the correlation between the temperature waveform and a predetermined variation corresponding to the change of the temperature waveform and showing at least part of the determined plural switching timings of the injection operations on the display unit.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO LTD1 AZA TAKAMICHI IWATSUKA-CHO NAKAMURA-KU NAGOYA-SHI AICHI 453-8515

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hattori, Michitaka Nagoya, JP 5 25
Imaeda, Satoshi Nagoya, JP 7 33
Kariya, Toshihiko Nagoya, JP 35 145
Nozaki, Shigeru Nagoya, JP 7 9

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