Method of manufacturing light emitting diode packaging lens and light emitting diode package
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United States of America Patent
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Jun 4, 2013
Grant Date -
Mar 24, 2011
app pub date -
Sep 21, 2009
filing date -
Sep 21, 2009
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Abstract
A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.
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