Method for constructing an instrument with a covered bore for subcutaneous implantation
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United States of America Patent
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Jun 4, 2013
Grant Date -
Dec 30, 2010
app pub date -
Jul 14, 2010
filing date -
Aug 24, 2000
priority date (Note) -
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Abstract
A method for constructing an instrument with a covered bore for subcutaneous implantation is provided. An incising body is formed by defining a non-circular coaxial bore and sharpening a cutting edge extending from a bottom distal end beyond the opening of the coaxial bore and affixing an attachment point at a top distal end. A plunger is constructed sized to fit within the coaxial bore. The plunger is inserted in the bore of the incising body. A cover is affixed to the attachment point, wherein the cover extends down to the bottom distal end and, when closed, the cover encloses the opening proximal to the cutting edge.
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