Manufacturing methods of multilayer printed circuit board having stacked via
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United States of America Patent
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Jun 4, 2013
Grant Date -
Feb 18, 2010
app pub date -
Aug 11, 2009
filing date -
Aug 14, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed therethrough; and a counter paste filled within the via.
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