Backlight module having housing provided with groove structure
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United States of America Patent
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May 28, 2013
Grant Date -
Mar 7, 2013
app pub date -
Sep 1, 2011
filing date -
Sep 1, 2011
priority date (Note) -
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Abstract
The present invention relates to a backlight module having housing provided with groove structure, wherein the backlight module comprises: a housing, a plurality of LED chips, a thermal conductive layer, a reflector, and a light guide plate. In which, the housing has a groove formed on a housing bottom thereof, and the circuit layer is disposed in the groove through a first thermally conductive insulating layer. In addition, the plurality of LED chips are disposed in the housing and welded on the circuit layer. In the present invention, the circuit layer and the LED chips are disposed in the groove of the housing, therefore, when mass producing the backlight module, it is able to ensure that the position of LED chips would correspond to the circuit layer in the housing, such that each the backlight module manufactured by mass production can be used for providing a stable light source.
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