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Country	kind	publication No.	Filing Date	Type	Sub-Type
DE	B4	DE102009026369	Aug 13, 2009	Patent	Grant
Type : Patent Sub-Type : Grant
PATENT (SECOND PUBLICATION)		Abdichtungs-Anordnung für Fahrzeugscheiben, Verfahren zu deren Herstellung und deren Verwendung		Apr 12, 2012
AU	B2	AU2010283810	Aug 02, 2010	Patent	Grant
Type : Patent Sub-Type : Grant
PATENT PROCEEDED BY OPI		Sealing arrangement for fixed vehicle panes, method for the production and use thereof		Jan 16, 2014
MX	A	MX2012001468	Aug 02, 2010	Patent	Application
Type : Patent Sub-Type : Application
PATENT APPLICATION		ARREGLO SELLADOR PARA CRISTALES DE VEHICULOS FIJOS, METODO PARA LA PRODUCCION Y USO DEL MISMO.		Feb 22, 2012
EA	B1	EA025521	Aug 02, 2010	Patent	Grant
Type : Patent Sub-Type : Grant
PATENT		ГЕРМЕТИЗИРУЮЩЕЕ УСТРОЙСТВО ДЛЯ НЕПОДВИЖНЫХ АВТОМОБИЛЬНЫХ СТЕКОЛ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ		Jan 30, 2017
BR	A2	BR112012002901	Aug 02, 2010	Patent	Application
Type : Patent Sub-Type : Application
APPLICATION FOR A PATENT OF INVENTION / PIPELINE PATENT PUBLISHED WITHOUT SEARCH REPORT		arranjo de vedação para vidraças de veículo automotivo, método de produção de um arranjo de vedação, e, uso do arranjo de vedação.		Apr 05, 2016
WO	A1	WO2011018379	Aug 02, 2010	Patent	Application
Type : Patent Sub-Type : Application
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT		ABDICHTUNGS-ANORDNUNG FÜR FESTE FAHRZEUGSCHEIBEN, VERFAHREN ZU DEREN HERSTELLUNG UND DEREN VERWENDUNG		Feb 17, 2011
KR	B1	KR101667083	Aug 02, 2010	Patent	Grant
Type : Patent Sub-Type : Grant
PATENT SPECIFICATION		고정된 자동차 판 유리용 실링 장치, 그의 제조 방법 및 용도		Oct 17, 2016
JP	B2	JP5779580	Aug 02, 2010	Patent	Grant
Type : Patent Sub-Type : Grant
PUBLISHED GRANTED PATENT (SECOND LEVEL)		自動車用窓ガラスの封止機構、その製造方法、およびその使用		Sep 16, 2015
CN	B	CN102470739	Aug 02, 2010	Patent	Grant
Type : Patent Sub-Type : Grant
GRANTED PATENT FOR INVENTION		Sealing arrangement for fixed vehicle panes, method for production and use thereof		Feb 04, 2015
EP	B1	EP2464532	Aug 02, 2010	Patent	Grant
Type : Patent Sub-Type : Grant
Patent		ABDICHTUNGS-ANORDNUNG FÜR FESTE FAHRZEUGSCHEIBEN UND DEREN VERWENDUNG		Jun 29, 2016

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SAINT-GOBAIN GLASS FRANCE	KOLB WATT FRANCE COURBEVOIE HAUTS-DE-SEINE

International Classification(s)

• B60J:WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR S....

• 2010 Application Filing Year
• B60J Class
• 331 Applications Filed
• 232 Patents Issued To-Date
• 70.10 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Timmermann, Alwin	Cologne, DE	17	163
# of filed Patents : 17 Total Citations : 163

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Patent Citation Ranking

• 11 Citation Count
• B60J Class

• 62.61 % this patent is cited more than
• 12 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 28, 2024

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 28, 2013	US,8449016,B2   US8449016B2	GRANTED PATENT AS SECOND PUBLICATION
May 24, 2012	US,20120126567,A1   US20120126567A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9615444

Manufacturing of a heat sink by wave soldering

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Abstract

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An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.

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Description

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Claims

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Claims data not available

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Legal Events

 

• FEPP2024
• AS2022
• MAFP2020
• I2017
• STCF2017
• P2016
• F2015
• PD2013

Date	Code	Event	Description
Nov 25, 2024	FEPP	FEE PAYMENT PROCEDURE	free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
May 30, 2022	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:STMICROELECTRONICS S.R.L.;REEL/FRAME:060301/0355 Owner name: STMICROELECTRONICS INTERNATIONAL N.V., SWITZERLAND Effective Date: May 30, 2022
Sep 19, 2020	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Apr 04, 2017	I	Issuance
Mar 15, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Mar 17, 2016	P	Published
Nov 24, 2015	F	Filing
Apr 05, 2013	PD	Priority Date