Leadframe structures for semiconductor packages
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United States of America Patent
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May 21, 2013
Grant Date -
N/A
app pub date -
Feb 24, 2010
filing date -
Apr 28, 2006
priority date (Note) -
Expired
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Abstract
A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.
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