Method of forming a semiconductor device and semiconductor device
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United States of America Patent
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May 21, 2013
Grant Date -
Apr 5, 2012
app pub date -
Dec 12, 2011
filing date -
Apr 11, 2006
priority date (Note) -
Expired
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Abstract
A method of forming a semiconductor device comprises forming a control electrode over a portion of a semiconductor layer, forming recesses extending into the semiconductor layer on opposing sides of the control electrode, and forming doped regions in the semiconductor layer through the recesses. The doped regions form current electrode regions of the semiconductor device and each doped region extends into the semiconductor layer from at least a base of a recess. The method further comprises forming, after forming the doped regions, strained semiconductor regions in the recesses, wherein a junction between each doped region and the semiconductor layer is formed below an interface between a strained semiconductor region and the semiconductor layer.
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