Method for manufacturing semiconductor device and surface protective tape
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United States of America Patent
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May 21, 2013
Grant Date -
Mar 3, 2011
app pub date -
Sep 2, 2010
filing date -
Sep 3, 2009
priority date (Note) -
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Abstract
A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.
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