Multi-cavity vacuum electron beam device for operating at terahertz frequencies
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United States of America Patent
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May 14, 2013
Grant Date -
Nov 19, 2009
app pub date -
Oct 24, 2008
filing date -
May 15, 2008
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Abstract
The present invention relates to the formation of a vacuum electronics circuit by the fusion bonding of multiple substrate wafers, e.g., silicon, copper, or other suitable conductive material, each etched using DRIE, cut using EDM, or machined by other suitable means. Other aspects of the invention relate to the alignment of a cathode with tube by fusion bonding the cathode wafer to a tube built using the fabrication methods described herein. Yet other aspects involve the alignment of dies or wafers during the fabrication of a vacuum electronics device using the “lego” technique outlined herein. In yet other aspects, fabrication methods are described.
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