Amorphous multi-component metallic thin films for electronic devices
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United States of America Patent
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May 7, 2013
Grant Date -
Nov 18, 2010
app pub date -
May 10, 2010
filing date -
May 12, 2009
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Abstract
An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.
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