Mold clamping device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8435021
APP PUB NO 20120269917A1
SERIAL NO

13360008

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A mold clamping device includes a first fixed member to which a stationary mold is to be attached; a first movable member to which a movable mold is to be attached; a second movable member configured to move together with the first movable member; a second fixed member provided between the first movable member and the second movable member; a mold clamping force generating mechanism configured to generate a mold clamping force due to an electromagnetic force between the second movable member and the second fixed member; and a mold clamping force amplifying mechanism configured to amplify the mold clamping force generated by the mold clamping force generating mechanism.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
SUMITOMO HEAVY INDUSTRIES LTDJAPAN

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyatake, Tsutomu Kanagawa, JP 19 260
Okada, Norihito Chiba, JP 12 65
Terada, Shinji Kanagawa, JP 8 133

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 7, 2024
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00