Hermetic sealing cap

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United States of America Patent

PATENT NO 8431820
APP PUB NO 20110048757A1
SERIAL NO

12990719

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A more thinnable hermetic sealing cap can be provided. This hermetic sealing cap (10) is employed for an electronic component housing package (100) housing an electronic component (40) and includes a cap body portion (1) mainly composed of Ti.

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Patent Owner(s)

Patent OwnerAddress
NEOMAX MATERIALS CO LTD2-19-1 MINAMI-SUITA SUITA-SHI OSAKA 564-0043

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hira, Junji Izumi, JP 2 22
Yamamoto, Masaharu Minamikawachi-gun, JP 32 319

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