Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
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United States of America Patent
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Apr 30, 2013
Grant Date -
Feb 14, 2008
app pub date -
Jul 27, 2007
filing date -
Aug 8, 2006
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Abstract
A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
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