Polishing pad
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United States of America Patent
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Apr 30, 2013
Grant Date -
Aug 2, 2012
app pub date -
Apr 11, 2012
filing date -
Oct 14, 2009
priority date (Note) -
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Abstract
To provide a polishing pad (14) useful for polishing semiconductor materials having a high hardness. The polishing pad (14) is used for polishing a workpiece (16) in combination with loose grains and comprises a polishing surface (15) comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.
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