Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece
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United States of America Patent
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Apr 23, 2013
Grant Date -
Sep 15, 2011
app pub date -
May 20, 2011
filing date -
Nov 28, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed.
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