Thin film resistor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 23, 2013
Grant Date -
Jun 2, 2011
app pub date -
Aug 25, 2010
filing date -
Nov 30, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and structure for a semiconductor device which provides for an etch of a metal layer such as an interconnect layer which does not affect a thinner layer such as a thin film resistor (TFR) layer, such as a circuit resistor. In one embodiment, a TFR resistor layer is protected by a patterned protective layer during an etch of the metal layer, and provides an underlayer for the metal layer. In another embodiment, the TFR layer is formed after providing the patterned metal layer. The metal layer can provide, for example, end caps for the circuit resistor.
First Claim
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International Classification(s)
- 2010 Application Filing Year
- H01L Class
- 16510 Applications Filed
- 13147 Patents Issued To-Date
- 79.64 % Issued To-Date
