Semiconductor device
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United States of America Patent
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Apr 16, 2013
Grant Date -
Nov 18, 2010
app pub date -
Apr 2, 2010
filing date -
May 12, 2009
priority date (Note) -
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Abstract
A semiconductor device includes a lower-layer wire, an upper-layer wire including a wire portion and a first wide portion whose wire width is greater than the wire portion, and a contact formation portion in which a contact portion for connecting the lower-layer wire and the first wide portion with each other is provided. The contact formation portion has a planar shape of which a length L1 in a direction parallel to a wire width direction of the first wide portion is greater than a length L2 in a direction parallel to a wire length direction of the first wide portion.
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