Methods of fabricating semiconductor devices and semiconductor devices fabricated by the same

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United States of America Patent

PATENT NO 8420551
APP PUB NO 20110165761A1
SERIAL NO

12961054

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Abstract

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Example methods and example embodiments include methods of fabricating semiconductor devices and semiconductor devices fabricated by the same. Example fabricating methods include forming a first nanowire, oxidizing the first nanowire to form a first nanostructure including a first insulator and a second nanowire, and oxidizing the second nanowire to form a second nanostructure including a second insulator and nanodots. Example semiconductor devices include nanostructures including nanodots and nanostructures providing storage nodes in memory devices.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO KOREA SUWON SUWON GYEONGGI-DO
INDUSTRY-ACADEMIC COOPERATION FOUNDATIONSEODAEMUN-GU SEOUL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Mann-Ho Seoul, KR 3 33
Kim, Myung-Jong Hwaseong-si, KR 4 45
Kim, Sang-Yeon Seoul, KR 11 91
Ko, Dae-Hong Seoul, KR 9 242
Sohn, Hyun-Chul Seoul, KR 15 585
Yeo, In-Seok Seoul, KR 42 849

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