Optical characterization of photonic integrated circuits
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United States of America Patent
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Apr 2, 2013
Grant Date -
Oct 1, 2009
app pub date -
May 5, 2008
filing date -
May 4, 2007
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Abstract
In one aspect, the present invention provides techniques and apparatus for optical characterization of photonic devices and/or circuits. By way of example, the techniques can be used to identify damaged devices in photonic integrated circuits. In some embodiments, thermal imaging is employed as a diagnostic tool for characterizing the devices/circuits under investigation. For example, in one embodiment, integrated cascaded semiconductor amplifiers can be characterized using amplified spontaneous emission from one amplifier as a thermal modulation input to another amplifier. A thermoreflectance image of the second amplifier can reveal flaws, if present. Further, in some embodiments, thermal imaging in conjunction with a total energy model can be employed to characterize the elements of photonic circuits optically and/or to map the optical power distribution throughout the circuits.
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