Temperature-controlled enclosures and temperature control system using the same
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United States of America Patent
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Apr 2, 2013
Grant Date -
Feb 25, 2010
app pub date -
Nov 4, 2009
filing date -
Mar 20, 2006
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Abstract
A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.
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