Thermal interface materials and methods for making thereof
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United States of America Patent
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Mar 26, 2013
Grant Date -
Aug 12, 2010
app pub date -
Jan 9, 2008
filing date -
Jan 10, 2007
priority date (Note) -
Expired
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Abstract
A thermal interface material is constructed from a base matrix comprising a polymer and 5 to 90 wt. % of boron nitride filler having a platelet structure, wherein the platelet structure of the boron nitride particles are substantially aligned for the thermal interface material to have a bulk thermal conductivity of at least 1 W/mK.
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