Plasma oxidation method and plasma oxidation apparatus
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United States of America Patent
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Mar 26, 2013
Grant Date -
Oct 13, 2011
app pub date -
Apr 12, 2011
filing date -
Apr 13, 2010
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Abstract
A plasma oxidation method includes the steps of: generating oxygen-containing plasma with a process gas containing oxygen; applying a bias voltage to a substrate placed on a stage; and radiating positive ions and negative ions in the oxygen-containing plasma onto the substrate so as to perform plasma oxidation of the substrate while controlling a bias potential of the substrate in such a manner that a maximum value Vmax and a minimum value Vmin of the bias potential and a plasma potential Vp satisfy a following relationship: Vmin
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