Component bonding using a capillary effect
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United States of America Patent
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Mar 26, 2013
Grant Date -
Jul 14, 2011
app pub date -
Mar 23, 2011
filing date -
Dec 10, 2002
priority date (Note) -
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Abstract
A method of attaching a component to a substrate, including providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component, attaching a first solder pad to the component, inserting the component into the guide cavity, providing a second solder pad, offset from the first solder pad and near the cavity, and inserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads.
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