Method and apparatus for automatic application and monitoring of a structure to be applied onto a substrate
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United States of America Patent
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Mar 19, 2013
Grant Date -
Jan 31, 2008
app pub date -
Jul 16, 2004
filing date -
Dec 23, 2003
priority date (Note) -
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Abstract
A method and apparatus are provided for automatic application and monitoring of a structure to be applied onto substrate. A plurality of cameras positioned around an application facility are utilized to monitor the automatic application of a structure on a substrate by means of a stereometry procedure. Three-dimensional recognition of a reference contour position results in the overlapping area to be used for gross adjustment of the application facility prior to applying the structure.
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