Substrate for suspension
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United States of America Patent
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Mar 19, 2013
Grant Date -
Apr 19, 2012
app pub date -
Nov 23, 2011
filing date -
Apr 4, 2007
priority date (Note) -
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Abstract
A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
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