Heat sink for power module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8387685
APP PUB NO 20090314474A1
SERIAL NO

11919368

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Abstract

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A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI2-1 TOYODA-CHO KARIYA-SHI AICHI 4488671 ?4488671
SHOWA DENKO K K13-9 SHIBADAIMON 1-CHOME MINATO-KU TOKYO 105-8518

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furukawa, Yuichi Oyama, JP 65 562
Kimbara, Masahiko Kariya, JP 52 718
Kono, Eiji Kariya, JP 41 386
Kubo, Hidehito Kariya, JP 59 1246
Nakagawa, Shintaro Oyama, JP 21 201
Otoshi, Kota Kariya, JP 10 158
Tanaka, Katsufumi Kariya, JP 41 295
Toh, Keiji Kariya, JP 33 473
Wakabayashi, Nobuhiro Oyama, JP 16 315
Yamauchi, Shinobu Oyama, JP 22 291

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